Important Dates

May 30, 2018 (Extended Deadline)

Special Session Proposal Due

May 30, 2018 (Extended Deadline)

Paper Submission Deadline

May 30, 2018 (Extended Deadline)

Industry Session Paper Submission Due

May 30, 2018 (Extended Deadline)

WiP Paper Submission Due

May 30, 2018 (Extended Deadline)

Poster/Demo Submission Due

June 25, 2018

Authors Notification

August 8, 2018

Camera-ready & Registration




Sponsors

Program Committee

•   Syed Hassan Ahmed, University of Central Florida, USA
•   Sabu M. Thampi, Indian Institute of Information Technology and Management - Kerala, India
•  Deze Zeng, China University of Geosciences (Wuhan), China
•   Aniello Castiglione, University of Salerno, Italy
•   Philip James, Newcastle University, UK
•   Parag Kulkarni, UAE University, UAE
•   Kouichi Sakurai, Kyushu University, Japan
•   Zaheer Khan, University of the West of England, UK
•   Jianhua He, Aston University, UK
•   Song Guo, The Hong Kong Polytechnic University, Hong Kong
•   Richard Hill, University of Huddersfield, UK
•   Mohammad A. Hoque, East Tennessee State University, USA
•   Ellie Cosgrave, UCL, UK
•   Benjamin Agbo, University of Huddersfield, UK
•   Zeeshan Aziz, University of Salford, UK
•   Joonsang Baek, University of Wollongong, Australia
•   Sergio Campos, TECNALIA Research & Innovation, Spain
•   Minsi Chen, University of Huddersfield, UK
•   Tianhua Chen, University of Huddersfield, UK
•   Michael W. David, National Intelligence University, USA
•   Aine Mac Dermott, Liverpool John Moores University, UK
•   Tim Farnham, Toshiba Research Europe Ltd., UK
•   Alex Gluhak, Digital Catapult, UK
•   Sedat Gormus, Karadeniz Technical University, Turkey
•   Samiul Hasan, University of Central Florida, USA
•   Selena He, Kennesaw State University, USA
•   Xiaojun Hei, Huazhong University of Science and Technology, China
•   Salil Kanhere, University of New South Wales, Australia
•   Siamak Najjar Karimi, University of Huddersfield, UK
•   Kewen Liao, Swinburne University of Technology, Australia
•   Peng Liu, Hangzhou Dianzi University, China
•   Masahiro Mambo, Kanazawa University, Japan
•   Pritesh Mistry, University of Huddersfield, UK
•   Parag Mogre, Siemens AG, Germany
•   Luis Moreira-Matias, NEC Research Labs, Germany
•   Robert Olszewski, Warsaw University of Technology, Poland
•   Shengli Pan, China University of Geosciences (Wuhan), China
•   Zeeshan Pervez, University of the West of Scotland, UK
•   Rana Muhammad Qasim, University of Wolverhampton, UK
•   Yi-Zhi Ren, Hangzhou Dianzi University, China
•   Wenjie Ruan, University of Oxford, UK
•   Kamran Soomro, University of the West of England, UK
•   Siva Subramani, Vodafone Group, UK
•   Yongliang Sun, Nanjing Tech University, China
•   Kenichi Takahashi, Torroti University, Japan
•   Hisham Tariq, University of Salford, UK
•   Tian Wang, Huaqiao University, China
•   Xiaoyan Wang, Ibaraki University, Japan
•   Lam Kwok Yan, Nanyang Technological University, Singapore
•   Chung-Huang Yang, National Kaosiung Normal University, Taiwan
•   Linda Yang, University of Portsmouth, UK
•   Mingwu Zhang, Hubei University of Technology, China
•   Shigeng Zhang, Central South University, China
•   Xiaobo Zhou, Tianjin University, China

Organizers:

  


Contact: IEEEiSCI2018@googlegroups.com
Copyright iSCI-2018. Created and Maintained by iSCI-2018 Web Team.